The following is an analysis of ceramic preparation processes and category expansion

Chip multilayer ceramic capacitor (MLCC) is a capacitor widely used in electronic equipment. Its structure consists of three parts: internal electrode, ceramic layer and terminal electrode. The manufacturing process of MLCC includes stacking dielectric materials and internal electrodes in a staggered manner, then forming them through high-temperature sintering, and finally encapsulating metal layers on both ends of the chip to form a structure similar to a monolith, so it is also called a “monolithic capacitor” “.
The main function of MLCC is to store and release electrical energy through static electricity, and can store charges in a dielectric isolation between two poles of conductive materials. Applications include storing charge, AC filtering, bypassing, cutting or blocking DC, providing tuning and oscillation, etc.
In recent years, as electronic equipment has developed towards miniaturization, large capacity, high reliability and low cost, the market demand for MLCCs has continued to increase. Especially after its first birth in the United States in the 1960s, MLCC has been developed on a large scale in Japan. At present, the miniaturization, large capacity, high voltage and high frequency of MLCC have become the main trends in industry development. Many leading manufacturers are developing large-capacity MLCCs with capacities in the range of 10μF to 100μF, and this area has good profit margins.
In addition, as electronic machines and equipment develop towards high power and high withstand voltage, the high withstand voltage design technology, high voltage reliability testing technology and heat-resistant design technology of medium and high voltage MLCCs are also constantly improving. At the same time, mobile communication equipment such as mobile phones and computers have put forward higher requirements for the high-frequency characteristics of chip capacitors, further promoting the development of MLCCs in high-frequency.

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Post time: Oct-31-2024